Mar 29, 2020

Heterogeneous integration of GaAs pHEMT and Si CMOS on the same chip

In this work, we demonstrate the technology of wafer-scale transistor-level heterogeneous integration of GaAs pseudomorphic high electron mobility transistors (pHEMTs) and Si complementary metal–oxide semiconductor (CMOS) on the same Silicon substrate. GaAs pHEMTs are vertical stacked at the top of the Si CMOS wafer using a wafer bonding technique, and the best alignment accuracy of 5 μm is obtained. As a circuit example, a wide band GaAs digital controlled switch is fabricated, which features the technologies of a digital control circuit in Si CMOS and a switch circuit in GaAs pHEMT, 15% smaller than the area of normal GaAs and Si CMOS circuits.

Source:IOPscience

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Mar 24, 2020

Arsenic Formation on GaAs during Etching in HF Solutions: Relevance for the Epitaxial Lift-Off Process

The epitaxial lift-off (ELO) process is utilized to produce thin-film III-V devices, while the substrate (GaAs wafer) on which the III-V structure was grown can be reused. However, so far the direct reuse of these GaAs wafers is inhibited by the remnants on the wafer surface that cannot be removed in a straightforward fashion utilizing general cleaning methods. Therefore, etching of GaAs wafers in hydrofluoric acid was investigated by microscopic techniques, profilometry and X-ray photoelectron spectroscopy. It was found that immediately after etching the wafer surface is covered by a brown layer of elemental arsenic. The thickness and uniformity of this layer depend on both illumination during etching and the HF concentration. During storage of the etched wafer the As layer is replaced by As2O3 particles. It is shown that oxide particles form only when the wafer is exposed to light in the presence of air. A model that explains the As formation and the subsequent particle formation is given.

Source:IOPscience

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Mar 17, 2020

Optical Investigations of Directly Wafer-Bonded InP–GaAs Heterojunctions

The optical characteristics of directly wafer-bonded InP–GaAs heterojunctions have been investigated. By designing the bonding interface at standing-wave antinode, its influence on optical performances of bonded structures is magnified, which facilitates experimental detection using optical methods. Wavelength blueshift and reflectivity falling at the resonance mode were observed in wafer-bonded InP–GaAs heterostructures. Numerical analysis suggests that two effects involving thickness change of interfacial bonding layers and extra optical loss introduced by bonded junctions are responsible for the experimental observations, and these effects can be attenuated by lowering anneal temperatures and incorporating an  superlattice into the surface of InP-based materials. The results are useful for designing effective optical characteristics of wafer-bonded device structures.

Source:IOPscience

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Mar 10, 2020

Room temperature contactless electroreflectance characterization of InGaAs/InAs/GaAs quantum dot wafers

Contactless electroreflectance (CER) mapping has been performed on InGaAs capped InAs/GaAs quantum dot (QD) wafers of 2 inch diameter grown by molecular beam epitaxy. The CER spectra have revealed several features related to InAs self-assembled QDs and a quantum well (QW) formed of the InAs wetting layer and the InGaAs cap layer. The particular optical transitions have been identified based on theoretical calculations of the energy levels in the InAs/InGaAs/GaAs wetting layer related step-like QW, performed within the effective mass approximation. The influence of possible uncertainties in cap content or band offsets has also been analysed. The advantages of modulation spectroscopy, namely its absorption-like character and high sensitivity to optical transitions with even very low oscillator strength including those between the excited states, have allowed the energies of all the transitions along the wafer to be followed. The latter has shown that within experimental error the transition energies are independent of the position of the probing spot on the sample. It demonstrates not only a very high uniformity of the dot ensemble but also the wetting layer related QW and hence also the content and thickness of the InGaAs cap.

Source:IOPscience

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Mar 5, 2020

Bonding of Elastically Strain-Relaxed GaAs/InGaAs/GaAs Heterostructures to GaAs(001)

Bonding of elastically strain-relaxed GaAs/InGaAs/GaAs heterostructures has been achieved on GaAs(001) substrates by the method of in-place bonding. Pseudomorphic heterostructures were patterned and a sacrificial AlAs layer was removed by selective etching. As etching proceeds and the GaAs/InGaAs/GaAs structure is released from the substrate, elastic strain relaxation occurs and the strain-relaxed structures are weakly bonded in-place to the substrate. The bond between the strain-relaxed structure and the substrate was then strengthened by annealing under conditions similar to those used for whole wafer bonding of GaAs. The degree of strain relaxation of the InGaAs layer is determined by the relative thickness of the GaAs and InGaAs layers. The increase in the in-plane lattice parameter of these bonded GaAs/InGaAs/GaAs structures is 0.3-0.4%.

Source:IOPscience

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